Network IC Distributor

Network IC Distributor in China

  • Can be programmed and erased in-system with a standard 5V power supply.
  • Fast program/erase operation with extremely low current consumption.
  • Programmed and erased using standard EPROM programmers.
  • Incorporates a 2.4 GHz, IEEE 802.15.4 system-on-chips with embedded networking software.
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Professional Network IC Supplier - Rantle East Electronic

RANTLE Network IC is a 512k bit, 5-volt only CMOS flash memory organized as 64k can be programmed and erased in-system with a standard 5V power supply. The unique cell architecture of the Network IC results in fast program/erase operation with extremely low current consumption. The device can also be programmed and erased using standard EPROM programmers.

Network IC Price

RANTLE Network IC is designed to terminate bus lines in CMOS system. The integrated low-impedance diodes clamp the voltages of undershoots and overshoots caused by line reflection and ensure signal integrity.

Network IC also contains a bus-hold function that consists of a CMOS- buffer stage with a high-resistance feedback path between its output and its input.

Network IC Supplier

RANTLE Network IC incorporates a 2.4 GHz, IEEE 802.15.4 system-on-chips with embedded networking software. Network IC enables 99.999% network reliability in the most challenging RF environments.

Robust, reliable, high speed connectivity and control is possible with RANTLE Network IC. It enables system to be monitored securely over the internet, allows for precision control of industrial motors at production facilities.

RANTLE Network IC is a fully assembled and tested surface-mount circuit board featuring an ethernet single-port power-sourcing equipment (PSE) circuit for 54V supply rail system.

Network IC Distributor

At RANTLE, we strive to give you the best Network IC that guarantees safety, high strength and reliability. With almost 16 years’ experience of distributing electronic components. RANTLE became an independent Network IC distributor for our leading manufacturers.

Hurry and avail our one of a kind Network IC! We offer swift delivery of your orders with 30 days warranty.

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If you are interested in our Network IC, please feel to contact with us, we will try our best to meet your demand. Within 24 hours our friendly and knowledgeable sales team will contact you.

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Network IC: The Ultimate FAQs Guide

In this comprehensive guide, you will find answers to all questions you have been asking about network filters.

Among the key concepts you will learn here include components, technologies, benefits, architecture and specification of network integrated circuits, amongst others.

Take a look:

What is Network IC?

Network Integrated Circuits are semiconductor devices utilized in telecommunication setups and gadgets.

They are ICs that offer the logic for transmitting and accepting data (comprising of video and audio) on a telecommunication network.

Network ICs avoid the need of using extra devices for these functions.

Some network ICs come with a JTAG pin or integrated charge pump. Others offer protection against high temperatures, electrostatic discharge (ESD), or over-voltage conditions.

Wireless network IC Chip

Wireless network IC Chip

Which are the components of Network IC?

Network IC ensures efficient functioning of devices and systems by facilitating the transfer of data between IPs, including memories, dedicated blocks, processors, among others.

The three important components of Network integrated circuits include:

· Links

These are the elements that enable communication between routers.

· Network Interfaces (NIs)

NIs converts streams of bits coming from IP core to packets for conveyance to routers and the other way round.

· Routers

Routers draw the destination address out of every accepted flow control unit (flit) and deliver the flit to its purposed destination.

What are the Functions of Network IC?

Speech network IC

Speech network IC

Network IC have several different used depending on the types of device and application.

In some cases, you can use a Network ICs as framers, media access controllers, isolators, buffers, physical layer controllers, or link layer controllers.

In certain instances, you can apply network IC as RFID, sample rate converters, transceivers, repeaters, transmitters, protectors, receivers, or storage interfaces.

You can as well use other types of network IC as serializers-deserializers (SerDes), universal asynchronous receiver/transmitter, terminators, or subscriber line interface circuits (SLIC).

Network integrated circuits can equally come in the form of ZigBee end-devices, routers or coordinators and Voice-over-IP interfaces.

Is there a difference between Network IC and Network-on-Chip?

Network on chip architecture

Network on chip architecture

No, there is no major differences between Network IC and Network-on-chip since both serve the same purpose.

Abbreviated as NoC, a network on a chip is an advanced type of Network IC used in communication subsystems, mostly between modules found in a system-on-chip (SoC).

Just like in Network IC, the modules are commonly semiconductor IP cores that schematize several functions of the communication system.

Basically, the design of network-on-chip facilitates the transmission of messages from the source module to the target module through links that entail routing resolutions at switches.

It comprises of several point-to-point links which are interconnected using switches.

Network on a chip can be categorized as a scalable, uniformly switched fabric network.

In other words, NoC is a router-based packet switching system between modules in an integrated circuit.

Normally, it is an approach in which a single IC is utilized to execute communication aspects of large-scale to highly large-scale integration set-up.

A network-on-chip is favored in communication systems of large-scale design since it lessens the complexity entailed in the designing of wires.

It equally offers a well-controlled network with the ability to provide speed, power and reliability.

In cases of high-end communication system designs, using network-on-chip is regarded as the ideal integrated solution.

Which Technologies are used in Network IC?

Network integrated circuits apply a variety of technologies. The commonly used technology options consist of:

  • Current mode logic (CML)
  • Integrated services digital network (ISDN) and digital subscriber line (DSL)
  • High definition media interface (HDMI) and digital visual interface (DVI)
  • Emitter coupling logic (ECL), low-voltage PECL, and positive ECL (PECL)
  • Gunning transceiver logic plus (GTLP) and gunning transceiver logic (GTL)
  • Low-voltage differential signaling (LVDS), multi-point LVDS (M-LVDS), and bus LVDS (BLVDS).

Moreover, network IC can equally use inter-integrated circuit I2 C, fiber channel, high-speed downlink packet access (HSDPA), Ethernet, global positioning system, infrared data access (IrDA), Panel Bus and general packet radio service (GPRS).

Some types of network IC can use Low-voltage CMOS, VMEbus, SIM and small computer systems interface technologies.

Furthermore, you can find certain types of network integrated circuits that employ peripheral component interconnect (PCI), PCI Express (PCIe) and compact PCI.

What are the Benefits of Network IC?

Network integrated circuit

Network integrated circuit

The best Network IC is one that ensures high strength, safety and reliability.

They guarantee reliable, robust high-speed connectivity and regulation.

In addition, the distinctive architecture of the network IC leads to quick configuration or erasing executions with exceptionally low current consumption.

Furthermore, it is also possible to program and erase network integrated circuits employing standard EPROM programmers.

It also enables you to monitor your systems safely over the internet, this facilitates precise modulation of industrial motors in manufacturing plants.

Which are the Different Architectures of Network IC?

Some of the architectures include:

Network IC on PCB

Network IC on PCB

· Single Shared Bus Architecture

A single shared bus is an elementary building block of on-chip network architecture.

It is made up of a group of shared, parallel cables that link a number of components on the network IC.

To carry out data transfer, only one module within the bus can command the shared wires at any given time.

This restricts the attainable performance and parallelism in the setup.

As a result, the architecture is unfit for network ICs comprising of numerous components.

Due to this fact, single shared bus topology lacks the scalability traits needed in multi-modules network IC systems.

· Shared Bus-based Communication Architecture

This is one of the commonly applied methods of communicating among components in a network IC design.

The clarity and efficiency of transmitting on buses have guaranteed that they stand to be the favored interconnection techniques currently.

A bus links probably a number of components using one shared channel.

You can physically implement the shared channel as a single wire that results in a parallel bus.

The parallel bus is the conventional execution option for buses in nearly all broadly utilized network IC bus-based communication architectures.

In this architecture type, a network of buses is interlinked by bridge elements.

Shared buses way up the network are conventionally run at elevated clock frequencies.

They help in joining high speed and performance components.

Conversely, shared buses way down the network are run at minimized frequencies in order to save on power.

They help in linking low execution, high latency components.

· Ad-hoc Bus Architecture

This network IC architecture runs the buses at varying frequencies, and if necessary, you can make the components have point-to-point links between one another.

What are the Features of Network IC?

Network integrated circuits have the following features:

  • Simplify the hardware needed for routing and switching operations
  • Multi-option support and multi-topology are practical for different sections of the device.
  • Enhance interoperability, scalability, and feature improvement
  • Enhances the power efficiency of sophisticated system-on-chip in comparison to other designs.
  • Offer high operating frequencies
  • Allow easy implementation of timing closure
  • Has minimal wire routing congestion
  • Integrates a system-on-chip having embedded networking software.

Which Routing Protocols can you Apply on Network IC?

There exist two main types of routing protocols in a network IC system:

· Static Routing

This is generally applied in very small networks, wherein there is a small number of routes to be programmed.

Nevertheless, static routing is at times employed in larger networks as sub-components of a general dynamically managed routing system.

In such situations, static routes usually program default routes or lead traffic from the network to some other network directed by another party.

· Dynamic Routing

This routing protocol is designed to manage changes in the network automatically with changing topology within the network.

The dynamic routing protocol is commonly applied in larger networks, while static routing protocol is ideal for very small networks.

The two primary types of dynamic routing are interior gateway protocols and exterior gateway protocols.

Being the common dynamic routing, IGPs regulate the routing within the network system.

Routing Information Protocol, OSPF, IS-IS, and EIGRP are the four most applied types of interior gateway protocols.

EGPs link several network domains, and they are referred to as exterior since the protocol is executed outside the network domains.

Modern networks utilize only one EGP, which is the Border Gateway Protocol (BGP).

The two main types of dynamic protocol are further categorized into path vector protocol, link-state protocol and distance vector protocol.

Dynamic routing protocols of network IC avoid the problem of manual configuration.

They are equally built to deal with network outages, as well as manage several complex topologies without the necessity for extra administrative assistance.

How do you prevent Livelocks and Deadlocks in Network IC?

Network IC

Network IC

Deadlock is a scenario in which the throughput of part or entire backpressure network falls to zero.

Meaning the network does not permit the transmission of packets.

On the other hand, livelock happens in a backpressure network.

Where, even though transmission with the network or part of it is not stopped, there is no transmission of one or more sole packets.

One simple method to tackle deadlocks is to begin conveying packets after the occurrence of a deadlock or when it is “about to happen”, i.e., with increasing congestion.

This technique works well for some types of packets, such as the traffic that can allow packet loss and “real-time” traffic.

Nevertheless, packets that need to eventually arrive at their destination will have to be re-relayed when they are dropped.

On the other hand, if there are peak amounts of buffers and bandwidth there will be no creation of deadlocks.

This is because there will be no overflow of buffers.

Nonetheless, this method normally wastes a lot of network resources and needs strict admission regulation procedures.

You can as well prevent deadlocks by assigning the links directions, thereby avoiding cycles.

A good example is the up/down routing on to a spanning tree.

Nevertheless, the chosen paths to form the spanning tree are usually not the shortest.

Thus, the links close to the spanning-tree root become bottlenecks, restricting the throughput of the network.

Another method of avoiding cycles in the network is to portion every physical link into several virtual channels.

Every channel having its own backpressure and queue protocol.

This facilitates the sharing of bandwidth among the virtual channels. This creates deadlock-free routes and acyclic virtual networks layers.

Finally, you can apply more complex buffer allocation methods (structured buffer pools) to prevent deadlocks.

For example, you can configure the network IC to allocate extra buffers for packets having higher “priority”.

This is because the packets have traveled long distances in the network or are very close to their destinations.

What is the Function of Network Processor in Network IC?

The network processor is an important component of any communication system design.

It works as an integrated circuit consisting of a set of features essential in networking applications. Being a programmable CPU integrated circuit, network processor has traits similar to those of CPUs usually found in various devices.

Typically, network processors are integrated into network equipment like:

  • Transmitter gadgets
  • Network monitoring systems
  • Routers
  • Session border controllers
  • Intrusion sensing and prevention gadgets
  • Network switches, and firewalls

Current network processors have advanced from simple designs to sophisticated ICs having programmable software.

Network IC System

Network IC System

They help in packet processing and a variety of other operations. The fundamental functions of network processors include:

  • Computation
  • deep packet inspection
  • Control processing
  • Fast allocation and packet buffers recirculation
  • Database lookup
  • Matching of bytes patterns in packets within a packet stream
  • Queue management.

With current strong growth in web networking, network processors have a crucial role in handling an overloaded network having heavy traffic and a fast growth rate.

They play important role in encryption, packet inspection, monitoring, queue management, traffic management and encryption within a large network.

Which are the Different Wireless and Serial Technologies used by Network IC?

Wireless IC

Wireless IC

Network ICs support a wide range of serial and wireless technologies.

Some of the serial technological approaches used include, universal serial bus (USB), USB 2.0 or USB on-the-go (USB OTG), serial peripheral interface (SPI), RS232, RS422, and RS485.

Wireless technologies applied in network ICs include wireless fidelity (Wi-Fi), wireless mesh (Wi-Mesh), WiMAX, ZigBee, CDMA, and WCDMA.

Normally, wireless network ICs can apply either 3G or 4G technologies.

Some of the 3G technologies employed in network integrated circuits include UMTS, EDGE and GSM.

Third Generation technology relies on a blend of packet and circuit switching. On the other hand, the 4G standard is based wholly on packet switching.

Bluetooth microchips offer wireless connection in solution-on-chip devices essential in the working of short-range radio communication systems.

The Bluetooth trademark is owned by Bluetooth Special Interest Group.

How do you Specify Network IC?

When you are specifying network integrated circuits to your supplier or manufacturer, ensure to make them aware of your desires with regards to the following parameters:

  • Data rate
  • Supply Voltage:
  • Operating current
  • Temperature junction
  • Interface
  • Power dissipation
  • Pin Count
  • Quality standards
  • IC Package Type

What is the Different Network IC Packages?

There are several different types of Network IC package available including:

· Ball-grid Array

Normally abbreviated as BGA, is a surface-mount packaging for network ICs.

BGA packages are utilized to mount components like microprocessor permanently.

It can offer more connection pins than can be placed on a flat or dual-in-line package.

You can use the entire bottom surface of the apparatus, rather than only the perimeter.

The traces linking the packages lead to the balls or wires which link the die to the package.

The traces are comparatively shorter than those in perimeter-only type of IC packages, resulting in better operation at high speed.

· Chip-scale Package

According to IPC/JEDEC J-STD-012, Chip-scale package is a type of network IC package that is surface mountable.

It has an area not greater than 1.2 times the primary area of the die.

CSPs are typically fabricated utilizing a lead frame which can be on the same substrate in majority of devices.

This facilitates mass assembling of IC packages, this maximizes the utilization of the interposer area.

Since the development of CSP for network IC, they have turned to be among the major trends in electronic sector, because of their many advantages.

There are four different types of chip-scale packages which include, wafer-level assembly type, custom lead frame type, rigid substrate interposer type, and flex circuit interposer type.

The advantages of chip-scale package for network IC are:

  • Consist of smaller size (minimized thickness and footprint)
  • Relatively easier process of assembly
  • Lower general production cost
  • Enhancement in electrical performance
  • Lesser weight

CSP also facilitate changes in die size because the design of the interposer can still accommodate a reduction in die size without changing the footprint of the chip-scale package.

Chip scale network IC packaging can blend the strengths of a several packaging technologies.

It can combine the technologies like bare die assembly advantages in terms of size and performance and reliability of encapsulated gadgets.

The substantial reduction in size and weight provided by the CSP makes it perfect for mobile gadgets such as digital camera, palmtops, laptops, and cell phones.

· Quad Flat Package

Also known as Quad Flat Pack, QFP is a package applied for surface mount network integrated circuits.

The Quad Flat Package is broadly utilized since it allows integrated circuits having high numbers of linkages to be used in electronic circuits.

It is an industry standard IC package format though there are several other variations.

These consist of variations on pins numbers and on others features of the package.

The quad flat pack comprise of a rectangular package that is a couple of millimeters thick.

The pack can either be rectangular having differing number of pins on either sides or square with equal number of pins coming from every edge.

Quad Flat package is made up of a top and bottom segment which are stuck together using glue. The interconnections come from the joint found on the package side.

The pins assume what is referred to as gullwing format, wherein they are bent downwards to the printed circuit board.

The pins usually just contact the PCB in order to enable easy soldering.

· Small Outline Package

A small outline integrated circuit is abbreviated as SOIC.

It is a surface-mounted IC package that covers an area of approximately 30 to 50 percent less than a corresponding dual-in-line package.

In addition, its typical thickness is 70 percent less than that of DIP.

Generally, they come with similar pin-outs as those of dual-in-line packages.

The convention for the package naming is SO or SOIC followed by the number of pins.

For instance, a 14-pin 4011 would be contained in a SO-14 or SOIC-14 package.

The small outline integrated circuit is shorter and narrower than a dual-in-line package.

SOIC-14 has a body width of 3.9 mm and a side-to-side pitch of 6 mm.

These measurements vary based on the type of SOIC, and there exist various variations.

As already mentioned, SOIC pack has “gull wing” leads emanating out of the two long sides, with a lead spacing of 1.27 mm.

· Dual-in-line Package (DIP)

DIP is a commonly used integrated circuit package.

This type of network IC package comes with dual parallel rows of pins protruding at a right angle from a rectangular plastic casing.

The general measurements of a DIP package rely on its number of pins.

The most popular pin counts are 4, 6, 8, 14, 18, 20, 28, and 40 pins. The Dual-in-line package employs a standard pin spacing that keeps the pins 2.54 mm apart.

Easy soldering of DIP integrated circuits on PCBs makes it the preferred network IC package.

However, in some instances, rather than soldering the package directly to the printed board circuit, you can use IC sockets.

Utilizing IC sockets permits easy insertion and removal of the DIP network IC from the PCB.

Are there Quality Standards for Network IC?

Some of the main quality standards for network integrated circuits are:

· EIAJ  and JEDEC Standards

The two standards regulate the size of the network IC.

The EIAJ small outline integrated circuit size is about 5.3 mm wide, whereas JEDEC SOIC size is about 3.8 mm wide.

In addition, EIAJ packages have a comparatively greater thickness and length.

Nonetheless, the packages are the same in every other aspect.

· AEC-Q100 Standard

This is a failure mechanism-based stress examination standard for packaged network ICs utilized in automotive applications.

It is a specification instituted by the Automotive Electronics Council to establish qualification stipulations and methods for packaged ICs applied in the automotive industry.

An AEC-Q100 certified network IC implies that it has passed the stipulated stress tests and assures a certain degree of quality or reliability.

· IEC International Standards

There are a number of IEC standards series that govern various aspects of ICs.

IEC 61967-8:2011, for instance, describes an electromagnetic radiated emission measurement mechanism for emissions coming out of the network IC.

The technique applies an integrated circuit stripline that determines radiations within 150 to 3GHz frequencies.

What are the Common Problems when using Network IC?

The main challenges faced when using a Network IC include:

a) Power Budgeting

The network IC needs to function within a very tight power budget.

This is brought about by the inability of a human to comfortably work with a hot device, and the battery size that the network and communication system can accommodate.

Addressing these problems requires exhaustive ultra-low-power techniques.

The methods should consider optimization and analysis as an important design enablers.

b) Signal and Power Integrity

Signal and power integrity is an escalating challenge promoted by two extreme cross-trend. There is an increase in power noise levels with a decrease in power supply levels.

This trend is anticipated to get worse as the semiconductor industry moves to 3D FinFET technologies that enables the utilization of very low power supply levels.

More dynamic failures due to voltage drop have been experienced and are anticipated. Particularly, for sophisticated lower-power designs having 100+ eccentric domains, on-chip regulators, clock-/power gating, among other features.

c) Component and System Reliability

Reliability is a frequently overlooked network IC challenge, which is essential for technology nodes.

It is common knowledge that electrostatic discharge (ESD) and electro-migration events may result in failure of integrated circuits.

The rate of these events and the probability of such failures rise substantially at the advanced fabrication nodes.

d) Mechanical and Thermal Stress

This is a problem both at the component and system level of the network IC.

The effect of raised temperatures, specifically on the silicon, is a growing concern.

When not correctly modeled, thermal runways can substantially lower the Mean-Time-to-Failure (MTF) and performance of a high-performance network IC fabricated in an advanced node.

This is a chip-package-system issue.

e) The capability of the System to Comply with Regulatory Requirements

Network and communication systems should meet regulatory requirements relating to electromagnetic compatibility (EMC) and electromagnetic interference (EMI).

Nonetheless, the network integrated circuits controlling these structures are not anymore low-frequency, simple designs.

The network ICs are multi-core, high-frequency apparatuses having a considerable number of on-chip memories.

They should be designed together with cable harnesses and printed circuit boards.

This is to ensure that near- and far-field electromagnetic spectra comply with government regulatory requirements.

How do you Test the Quality of Network IC?

After fabrication of network ICs, they undergo quality testing to evaluate their visual, electrical and functional characteristics.

Verifying the IC design helps you attain high-quality yield with consistent improvements in production.

These are the common tests used for evaluating the quality of network ICs:

  • Wafer tests
  • Temperature semiconductor testing
  • Qualification, burn-in, and environmental test
  • Failure analysis
  • Final tests (after packaging)

As you can see, the network IC plays an integral role in modern electronic systems.

However, the best performance of your telecommunication systems depends on choosing a high quality and reliable network IC.

At Rantle, we design and manufacture high-quality network ICs.

Contact us today for high quality and reliable network integrated circuits.

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